Fine Pitch Solder-Cup Pin and Socket Interconnects
Fine Pitch solder-cup pin and socket Interconnects are a family of connectors offering wire termination solutions on a space saving .050” (1,27mm) pitch or 2mm pitch. These connectors incorporate high temperature insulators and precision machined pins and receptacles to provide high quality interconnects in a small-scale package. The smaller pitch of these interconnects required the development of new assembly processes to ensure uniform alignment of the cups, an important feature when handling small gauge wires and miniature components. Both headers and sockets may be mated with a variety of Mill-Max fine pitch connectors, allowing a user to mix and match termination styles to overcome diverse interconnect challenges.
In this example, a sensor is being connected to a PCB in a parallel orientation. The connector may be soldered to the board during board assembly via intrusive reflow, the most widely used process today. The wires are then soldered to the connector terminals; this may require a lower temperature solder so as not to disturb the solder joint to the PCB.