Introduction to Machined Pin, Board Interconnects
In the rapidly expanding technological world we live in today, having a solution for board-to-board interconnection has become increasingly critical to ensuring product capability, quality and performance.
At Mill-Max, we've responded to the challenges that face design engineers every day with a variety of options to accommodate everything from space-saving, fine-pitch requirements to larger, more robust applications in which products are subjected to very harsh environments.
Board Stacking Applications
In some board-to-board applications, a designer may simply want to make a permanent connection between two boards.This can be readily achieved by soldering a Mill-Max through-hole header to both the main (mother) board and mezzanine (daughter) board.
Mill-Max has addressed the need to fit more components in less packaging space due to the ever-increasing demand for smaller and smaller electronic products with our fine-pitch connectors. Mill-Max offer standard interconnects in 1mm, 2mm, .070", .050" pin-to-pin spacing, and has the capability to produce application-specific products in 0,8mm pin-to-pin spacing, as well.
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Surface Mount Applications
As a means of accommodating pc boards that are comprised entirely of surface mount components, Mill-Max offers surface mount headers and sockets in a variety of packages, from fine-pitch to .100" centers. These connectors eliminate the need for added processes, such as having to drill holes and wave solder pc boards that are otherwise comprised exclusively of surface mount components. These connectors can undergo reflow soldering with the other surface mount components, adding no extra steps to the solder process.
Low Profile Applications
For applications requiring boards to be mated very closely together to save vertical space, a carrier socket can be a perfect part of the solution. Mill-Max can provide virtually any receptacle on a carrier, in almost any configuration. The carrier socket is placed in position, allowing the receptacles to fall into the holes in a pc board. Only the shoulder of the receptacle rests on the surface of the pc board. After wave soldering, the carrier is removed and only the height of the shoulder is left above the board. Effectively, the entire "insulator" has been eliminated. Next, a male header is mated to provide for a very tightly-spaced, pluggable board-to-board interconnect.
Organic Fibre Plug® Board Pass Through Applications
When requirements dictate that three boards be joined together in a pluggable fashion, Mill-Max has addressed this need with our series 834 and 835 Organic Fibre Plug® Pass-Through Sockets. The Organic Fibre Plug® (OFP®) receptacle is an open-bottom, through-hole part with a "plug" made of organic material installed at the bottom. This plug protects the contact area from solder and flux contamination when the socket is installed into plated-through holes in a pc board. For more information view our OFP® application note.
Horizontal Board Interconnect Applications
For applications requiring boards to be plugged in on a horizontal plane, Mill-Max also offers right-angle sockets and headers.
Mill-Max right-angle sockets and headers can also be used in tandem with vertical mount sockets and headers to create a perpendicular interconnect between two boards.
As a means of connecting two boards on a parallel plane using surface mount technology, Mill-Max offers HSMT connectors which are available with a or without a "Z-Bend" tail, or with removable caps to achieve a lower profile interconnect.
Spring-Loaded Board to Board Applications
For applications where there is a wide variance on the spacing between two boards due to stack-up tolerances, Mill-Max's spring-loaded connectors are the perfect solution. Our spring-loaded pins interface with pads on a mating pc board to provide for a highly reliable connection that offers true compliancy for almost any design.
Moreover, for applications where the between-board space is unusually wide, Mill-Max offers Target Connectors to take up some of the gap. The Target Connector will help minimize the length of the lead on the spring pin connector so damage during handling doesn't occur due to the exposing of overly-long plungers.
Also, when a product's assembly doesn't offer the advantage of visibility for alignment of a traditional socket and header (know as a "blind mate") damage can occur to either the lead of the header or the retention feature of the socket. This problem is readily eradicated with a Mill-Max spring pin connector as the mating pad or Target Connector won't damage the plunger upon assembly. Available in both SMT and through-hole, loose pin, SIP, dual-row or custom configurations in non-standard pin spacing, Mill-Max's spring pin series help you connect with confidence.
Start your search using our product finder now, or contact a Mill-Max Applications Engineer today and let us show you how our precision high-speed turning technology can address your interconnect requirements reliably, economically and efficiently.
Last Updated: 11/15/2018 02:09 PM
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