PROPERTIES
OF METALS USED BY MILL-MAX
PROPERTIES OF PLASTICS USED BY MILL-MAX
PROPERTIES OF PLATINGS USED BY MILL-MAX
METALS
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Copper alloy rod and wire for
precision-machined pins, receptacles & solder terminals (alloys
contain 3 to 4% lead to permit "free machining").
BRASS ALLOY 360 (UNS C36000) per ASTM
B 16
PHOSPHOR BRONZE
Alloy 544(UNS C54400) per ASTM B 139
Copper or Nickel alloy strip
for stamping "multi-finger" spring contacts
BERYLLIUM
COPPER Alloy 172 (UNS C17200) per ASTM B 194
BERYLLIUM NICKEL
Alloy 360 (UNS N03360)
Properties of BRASS:
Stock diameters available: .062/.072/.078/.093/.125/.156/.187"
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%
Temper as machined: H02/H04
Modulus of elasticity: 14000 ksi
Tensile strength: 70-90 ksi
Hardness as machined: 80-90 Rockwell B
After machining, brass parts are often annealed (softened)
for subsequent bending, swaging or crimping. A partial anneal
down to 60±10 RB is recommended for 90° bends, a full anneal
down to 35±15 RB is recommended for pins or terminals that
are swaged (riveted) to a circuit board or crimped to a wire.
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 1652°F/1625°F (liquidus/solidus)
Properties of PHOSPHOR BRONZE:
Used for pins requiring more durability than brass.
Stock diameters available: .072/.078"
Chemical composition: Cu 88%, Sn 4%, Zn 4%, Pb 4%
Temper as machined: H04
Modulus of elasticity: 15000 ksi
Tensile strength: 70-80 ksi
Hardness as machined: 83 Rockwell B
Density: .321 lbs/in3
Electrical conductivity: 19% IACS*
Melting point: 1832°F/1706°F (liquidus/solidus)
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Modulus of Elasticity: 19000 ksi
Tensile Strength: 175-205 ksi
Yield Strength (0.2% offset): 150-185 ksi
Elongation: 3-10%
Stress Relaxation†: 96% of stress remains after 1,000 hours
@ 100 ºC 70% of stress remains after 1,000 hours @ 200 ºC
Hardness: 36-43 Rockwell C
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Melting point: 1796°F/1589°F (liquidus/solidus)
†Since BeCu loses its spring properties over time at < high
temperatures; it is rated for continuous use up to 150°C.
For "down-hole" and "burn-in" applications up to 300°C, Mill-Max
offers four contacts (#24, #26, #27, & #38) made from Beryllium
Nickel Alloy 360(UNS N03360)
Properties
of BERYLLIUM NICKEL:
Chemical composition: Ni 97.6%, Be 1.9%, Ti 0.5%
Modulus of Elasticity: 27000 ksi
Tensile Strength: 245 ksi
Yield Strength (0.2% offset): 200 ksi
Elongation: 9% min.
Hardness: 49 Rockwell C
Density: .294 lbs/in3
Electrical Conductivity: 7% IACS*
Melting point: 2417°F/2183°F (liquidus/solidus)
*International Annealed Copper Standard, i.e.: as a % of pure
copper.
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PLASTICS |
Standard plastics used for catalog products:
Injection Molded
PBT Polyester, Standard (Valox 420-SEO, black)
PCT Polyester, High Temp (Thermx CG933, black)
Nylon46, High Temp (Stanyl TE250F6 {30% glass}or
TE250F9 {45% glass}, black)
Machined
FR-4 Epoxy/Glass Laminate
Thicknesses available: .020", .031", .047", .062",
.093", .125" (natural color, beige)
Additional stocked materials for custom products:
Injection Molded
LCP (Vectra C130, black)
Machined
FR-4 Epoxy/Glass Laminate, .055" thick (black)
G-30 Polyimide/Glass Laminate, .062" thick (natural color, brown)
TEMPERATURE COMPARISON OF MILL-MAX MOLDED INSULATOR MATERIALS
MATERIAL BRAND GRADE HEAT DEFLECTION TEMP. (@ 264psi)
PBT Polyester Valox 420-SEO 400°F / 204°C
LCP Vectra C-130 469°F / 243°C
PCT Polyester Thermx CG-933 477°F / 247°C
Nylon 46 Stanyl TE250-F6 545°F / 285°C
or F9
Note: Materials above 446°F (230°C) are considered suitable for
"eutectic" reflow soldering, above 482°F (250°C) for "lead-free"
reflow soldering. |
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GOLD
per ASTM B 488
Type 1(99.7% min. gold),
Code C (130-200 HK {Knoop hardness}),
Class .25 (.25µm/10µ")
.50 (.50µm/20µ")
.75 (.75µm/30µ")
1.25 (1.25µm/50µ") |
SILVER
per ASTM B 700
Type 1 (99.9% min. silver),
Grade B (Bright),
Class S (anti-tarnish treatment),
Thickness (7.5µm/300µ" used for solder terminals) |
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TIN/LEAD
(93/7) per ASTM B 545,
(Appendix X6.3.2.5 to eliminate whisker growth)
Class A (2.5µm/100µ") or
Class B (5µm/200µ"),Bright
finish (Matte available to order) |
ELECTRO-SOLDER
(60/40) per ASTM B 579,
SC2 (8µm/300µ"), Bright finish (Matte available to order) |
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| NON-STANDARD
FINISH AVAILABLE FOR "LEAD-FREE" APPLICATIONS: |
| TIN
(100%) per ASTM B 545,
Class A (2.5µm/100µ") or
Class B (5µm/200µ"), Bright finish (Matte available to order) |
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| ALL
MILL-MAX PARTS REQUIRE AN UNDERPLATE:
Brass
parts need a barrier plate to prevent zinc diffusion, 50µ"
min. nickel or 100µ" min. copper is recommended by ASTM
B 545 & 579. ASTM B 488 also recommends a 50µ" min. nickel
barrier plate beneath gold to prevent copper diffusion inherent
with all copper alloy products. |
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MILL-MAX
STANDARD UNDERPLATE:
NICKEL per ASTM B 689, Type 2 (Bright),
Class 1.25 (1.25µm/50µ") or
Class 2.5 (2.5µm/100µ") |
ALSO
AVAILABLE FOR MILITARY & "NON-MAGNETIC" APPLICATIONS:
COPPER per ASTM B 734,
Class 2.5 (2.5µm/100µ") or
Class 5 (5µm/200µ") |
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