• Accepts JEDEC PLCCs MS-016, MS-018, MO-047 & MO-052 leaded plastic substrates.
• Insulator material is glass reinforced PPS Rated UL94V-0.
• Low profile for high density PC board stacking available.
• Standoffs provide clearance for heat dissipation and cleaning.
• Internal standoffs insure proper positioning of chip carrier in socket.
• Contacts are plated with 150µ” tin.
• Pre-lubricated and Tape & Reel available.

Choose a link to the right to explore the many standard options availailble